Graduate Student, University of Central Florida
Email address: firstname.lastname@example.org
Presented: November 5 and 6, 2020
“Mechanically Reconfigurable Materials and Devices based on 2D TMD layers”
The recent advances in modern electronics have been geared towards the combination of miniaturized device components and their deterministic integration onto unconventional platforms. This endeavor is aimed towards achieving new generation of electronic devices with exotic functionalities, which are unachievable with traditional approaches. Among these envisioned cutting-edge technologies, electronic devices which are mechanically reconfigurable and operable under harsh operational conditions such as mechanical deformation in form of stretching, twisting and folding offer tremendous amount of unparalleled opportunities. Traditional devices rely on intrinsically rigid and bulky three-dimensional (3D) silicon (Si) wafers, which need to undergo complicated and unsustainable fabrication steps to enable mechanical deformation. This bottleneck in conventional technologies and manufacturing triggered the exploration of new electronics materials possessing superior properties even at very low dimensions. Two-dimensional (2D) transition metal dichalcogenide (TMD) layers have gained increasing attention for their unique electrical, mechanical and optical properties unattainable in conventional thin films. Moreover, their intrinsically large strain limits, small thickness and van der Waals attraction makes them uniquely suited for mechanically reconfigurable electronics. In this talk, I will give an overview of my research efforts primarily focused on mechanically reconfigurable devices based on 2D TMD layers. This study encompasses synthetic methods for achieving wafer-scale high quality 2D TMD layers, directly grown on both rigid and deformable substrates, as well as novel approaches to deterministically transfer them onto arbitrary substrates, further diversifying their applicability. Furthermore, I will present viable strategies employing strain-engineering concepts to three-dimensionally architect 2D TMD layers into tailored geometry which can ensure high mechanical stability accompanying well preserved electrical/optical integrity. Lastly, I will present applications of these mechanically reconfigurable 2D TMD layers for emerging and unconventional electronics such as smart windows and wearable e-skin sensors by exploring their strain variable and invariable exotic properties.
Emmanuel Okogbue, Graduate Student, University of Central Florida
Emmanuel Okogbue is a fourth-year Ph.D. student in the Electrical Engineering Department at the University of Central Florida. He earned his M.S. in electrical engineering and obtained his B.S. in electrical and electronics engineering from Federal University of Technology, Akure while completing his senior year at Florida A&M University.
His research focus is in the area of nano-materials with a focus on mechanically reconfigurable devices using two-dimensional materials. He is an author of more than ten journal publications and has been a recipient of several awards including first prizes at the NanoFlorida International Conference in 2019 and Conference of Florida Graduate Schools, and was recently fully funded to present his research at the Materials Research Society conference in 2019. He has also carried out industrial research on nano-materials as a research intern at Honda Research Institute. Emmanuel is also an active member of the National Society of Black Engineers and Materials Research Society.